We have investigated gate oxide degradation in metal-oxide-semiconduct
or (MOS) devices as a function of high-field constant-current stress f
or charge injection from both gate and substrate. The two polarities a
re asymmetric: gate injection, where the substrate Si-SiO2 interface i
s the collecting electrode for the energetic electrons, shows a higher
rate of interface-state generation (DELTAD(it)) and lower charge-to-b
reakdown Q(bd). Thus the collecting electrode interface, which suffers
primary damage, emerges as a critical degradation site in addition to
the injecting electrode interface, which has been the traditional foc
us. Consistent with a physical-damage model of breakdown, we demonstra
te that interfacial degradation is an important precursor of breakdown
, and that the nature of breakdown-related damage is physical, such as
trap-generation by broken bonds.