A new p-channel GeSi-SIMOX device is presented. The device consists of
a Si/Ge0.3Si0.7/Si channel, which is grown pseudomorphically on a SIM
OX substrate. Due to reduced vertical electric field and band bending
at the surface of a GeSi-SIMOX device, hole confinement in the buried
channel is improved over that of a GeSi-bulk device. Experimentally, t
he effective channel mobility of this device is found to be 90% higher
than that of an identically processed conventional SIMOX device.