SI AND N DANGLING BOND CREATION IN SILICON-NITRIDE THIN-FILMS

Citation
Wl. Warren et al., SI AND N DANGLING BOND CREATION IN SILICON-NITRIDE THIN-FILMS, Applied physics letters, 63(19), 1993, pp. 2685-2687
Citations number
20
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
63
Issue
19
Year of publication
1993
Pages
2685 - 2687
Database
ISI
SICI code
0003-6951(1993)63:19<2685:SANDBC>2.0.ZU;2-4
Abstract
We observe the simultaneous creation of paramagnetic Si and N dangling bonds when N-rich silicon nitride thin films are optically illuminate d at low temperatures (110 K). Generally, only the Si dangling bond is observed if the illumination is performed at room temperature. In con trast, the N dangling bond is metastable, and has previously only been observed after a high temperature post-deposition anneal and followed by illumination. We propose that the low temperature illumination cau ses two processes: (1) Charge conversion of N3=Si+ and N3=Si-sites to give two N3=Si . dangling bonds, and (2) charge transfer between Si2=N - and N3=Si+ sites to form Si2=N . and N3=Si . dangling bonds.