S. Kordic et al., CORRELATION BETWEEN STRESS VOIDING OF AL(SI)(CU) METALLIZATIONS AND CRYSTAL ORIENTATION OF ALUMINUM GRAINS, Journal of applied physics, 74(9), 1993, pp. 5391-5394
The stress voiding behavior of Al(Si) (Cu) alloys has been investigate
d. The grain structure of the metal lines has been analyzed using the
electron backscatter diffraction technique in a scanning electron micr
oscope. A [111] fiber texture of aluminum has been observed perpendicu
lar to the wafer surface. A correlation has been found between a high
density of voids and the amount of misalignment of the [111] grain dir
ections with respect to the wafer normal.