CORRELATION BETWEEN STRESS VOIDING OF AL(SI)(CU) METALLIZATIONS AND CRYSTAL ORIENTATION OF ALUMINUM GRAINS

The stress voiding behavior of Al(Si) (Cu) alloys has been investigate d. The grain structure of the metal lines has been analyzed using the electron backscatter diffraction technique in a scanning electron micr oscope. A [111] fiber texture of aluminum has been observed perpendicu lar to the wafer surface. A correlation has been found between a high density of voids and the amount of misalignment of the [111] grain dir ections with respect to the wafer normal.