Time-resolved scanning tunneling microscopy has been used to study the
influence of atomic hydrogen on the growth behavior in silicon homoep
itaxy and the etch attack of atomic hydrogen onto the silicon surface
above 500 degrees C. In CVD of silicon on Si(lll) using disilane (Si2H
6) as gas phase precursor the presence of hydrogen on the surface play
s an essential role in all stages of growth. At temperatures above 400
degrees C, for each Si atom deposited on the surface one H atom is ad
sorbed additionally. Under the influence of hydrogen the density of is
lands increases during nucleation on the bare substrate. The nucleatio
n behavior in CVD, when quantitatively analyzed, differs distinctly fr
om the one during MBE-growth. As opposed to MBE, the density of nuclei
as a function of temperature and growth rate cannot be understood in
terms of classical rate equation based nucleation theories. Under the
influence of a closed hydrogen layer the topmost silicon layer is larg
ely immobilized and lateral island coarsening can only take place afte
r hydrogen desorption. At a high flux of disilane the growth rate is l
imited by this hydrogen desorption. The surface, which then has a hydr
ogen-coverage close to saturation, roughens linearly with coverage and
completely decays into facets of the [110]-zone. When the flux of the
precursor gas is interrupted the surface flattens with a time constan
t determined by the hydrogen desorption. Atomic hydrogen is able to re
move silicon from the surface visible in STM as step retrac tion. Abov
e 500 degrees C we found a linear increase of the removal rate with te
mperature.