RELIABILITY OF THE LAMINATE FROM ADVANCED COPNA-RESIN E-GLASS FABRICSSYSTEM/

Reliability of the advanced COPNA-resin laminate which exhibited high Tg at 255 degrees C, low coefficient of thermal expansion (CTE) at 5-7 ppm (xy-axis) and at 29 ppm (z-axis) was evaluated by temperature-hum idity-bias (THE) test, pressure-cooker (PC) lest, heat-shock test, hea t-cycle test, and conductive anodic filaments (CAF) test. The laminate exhibited higher reliability than the FR-4 graded epoxy-resin laminat e in every test, and exhibited higher reliability than the bismaleimid e-triazine resin laminate in the THE test, heat-shock test, and heat-c ycle test, The high reliability of the advanced COPNA-resin system is considered to be due to its high Tg and small CTE, In this paper, low CTE's of the advanced COPNA-resin laminate are also theoretically stud ied by using a model for uni-axially reinforced composites.