INTERMEDIATE LAYER BASE IN THE PROCESS OF COPPER COATING PLATE CYLINDERS

New technology for electrochemical removal of the copper shell from th e copper base of a cylinder requires creation at the cylinder surface of an indestructable base layer resistant with anodic and cathodic pol arization in copper plating sulfuric electrolyte, and also with a capa city to fulfil the function of a cathode substrate with electrodeposit ion of copper. A nickel coating is suggested as this layer. The behavi or of nickel is studied with electrochemical dissolution of copper fro m it. A potentiostatic dissolution regime is suggested for dissolving the copper shell providing stability for the nickel base layer and pro tection of the copper cylinder base from dissolution.