APPLICATION OF KRF EXCIMER-LASER LITHOGRAPHY TO 256 MBDRAM FABRICATION
Citation
S. Fukuzawa et al., APPLICATION OF KRF EXCIMER-LASER LITHOGRAPHY TO 256 MBDRAM FABRICATION, IEICE transactions on electronics, E76C(11), 1993, pp. 1665-1669
Categorie Soggetti
Engineering, Eletrical & Electronic
SICI code
0916-8524(1993)E76C:11<1665:AOKELT>2.0.ZU;2-9
Abstract
256 MbDRAM chips have been fabricated by mix-and-match method using hi
gh NA KrF excimer laser stepper and i-line stepper. In the case of KrF
stepper, the negative siloxane resist is used for rectangular and wir
ing patterns and the positive novolak-resin resist is used for hole pa
tterns. Both of these two kinds of resist produce accurate pattern sha
pe, allowable pattern profile, satisfactory depth of focus and suffici
ent overlay accuracy for device fabrication in 0.25 mum design rule.