In this study, with the use of a sensitive optical technique, we demon
strate the possibility of measuring the depth distribution of damage i
n GaAs that is generated by various ion-assisted processes such as ion
implantation and ion assisted plasma etching. We have used this techn
ique to measure the depth distribution of damage in both He and Ar imp
lanted GaAs and in inert gas and reactive ion etched GaAs. The sensiti
vity of the technique allowed us to measure damage profiles over a lar
ge range of ion energies and ion doses. We have also confirmed previou
sly published results indicating that damage created by sputter etchin
g is inversely proportional to the mass of the ions used in the etchin
g process.