B. Serier et al., SILVER ALUMINA SOLID-STATE BONDING - STUDY OF DIFFUSION AND TOUGHNESSCLOSE TO THE INTERFACE, Journal of the European Ceramic Society, 12(5), 1993, pp. 385-390
The study of Ag/Al2O3 interfaces achieved by solid state bonding shows
that silver diffuses in alumina during the joining process and later
annealings. This diffusion, particularly, along grain boundaries, is c
orrelated to the decrease of the toughness of alumina observed at the
same time close to the metal-ceramic interface.