SEALING OF ELECTROLYTICALLY FORMED POROUS FILMS OF ALUMINUM BY NICKELFLUORIDE PROCESS

Citation
Mr. Kalantary et al., SEALING OF ELECTROLYTICALLY FORMED POROUS FILMS OF ALUMINUM BY NICKELFLUORIDE PROCESS, Plating and surface finishing, 80(12), 1993, pp. 52-56
Citations number
15
Categorie Soggetti
Metallurgy & Mining
ISSN journal
03603164
Volume
80
Issue
12
Year of publication
1993
Pages
52 - 56
Database
ISI
SICI code
0360-3164(1993)80:12<52:SOEFPF>2.0.ZU;2-Q
Abstract
Since the early 1980s, nickel fluoride cold sealing of anodized alumin um, on the basis of energy saving processes, has been marketed in indu stry. Currently, it is possible to substitute cold sealing as an alter native to conventional hydrothermal sealing, almost without any drawba cks, while enabling reduced treatment time, reduced cost of operation and, most important, energy conservation. The most important criteria associated with cold sealing are covered, with attempts to present the findings as an independent view of the process.