Mr. Kalantary et al., SEALING OF ELECTROLYTICALLY FORMED POROUS FILMS OF ALUMINUM BY NICKELFLUORIDE PROCESS, Plating and surface finishing, 80(12), 1993, pp. 52-56
Since the early 1980s, nickel fluoride cold sealing of anodized alumin
um, on the basis of energy saving processes, has been marketed in indu
stry. Currently, it is possible to substitute cold sealing as an alter
native to conventional hydrothermal sealing, almost without any drawba
cks, while enabling reduced treatment time, reduced cost of operation
and, most important, energy conservation. The most important criteria
associated with cold sealing are covered, with attempts to present the
findings as an independent view of the process.