Je. Benci et al., A COMBINED EXPERIMENTAL AND ANALYTICAL INVESTIGATION OF CREEP DAMAGE DEVELOPMENT IN COPPER, Acta metallurgica et materialia, 42(1), 1994, pp. 225-238
A continuum damage mechanics (CDM) model was used to predict the devel
opment and distribution of creep damage in triaxially stressed regions
of oxygen-doped copper samples at 500-degrees-C based on uniaxial cre
ep tests performed on that same material. Axisymmetrically notched sam
ples of oxygen-doped copper were subjected to slow, constant-displacem
ent-rate tensile testing at 500-degrees-C and interrupted after variou
s test times. High resolution synchrotron radiography was used to imag
e the creep damage in the samples. The experimentally measured creep d
amage was then compared to the predictions from the continuum damage m
echanics modeling for the same two sample geometries. The experimental
ly determined distribution of creep damage correlates very well with t
he model if the growth of damage is assumed to be controlled primarily
by the maximum principal stress. Therefore, the growth of creep damag
e in oxygen-doped copper under the imposed stress conditions occurs by
a diffusive mechanism.