Different oxynitride gate dielectrics (NH3-nitrided, reoxidized NH3-ni
trided, N2-annealed NH3-nitrided and N2O grown oxides) are investigate
d for use in p+-polysilicon gate MOS devices. The comparison is based
on flatband voltage shift as well as decrease in inversion capacitance
. Results show that NH3-nitrided and N2-annealed NH3-nitrided oxides b
est suppress the boron penetration and, consequently, these two undesi
rable effects. These findings are explained based on the distribution
of nitrogen in various oxynitride dielectrics.