The morphology and microstructure of polysilicon films deposited by lo
w-pressure chemical vapour deposition (LPCVD) have been investigated a
s a function of deposition conditions. The deposition temperature was
varied from 540-640-degrees-C. As-deposited polysilicon films had a ro
ugh surface with (1 1 0) textured columnar grain structure, while as-d
eposited amorphous films had a smooth surface. The polysilicon film de
posited at the amorphous to polycrystalline transition temperature had
an extra-rough, rugged surface with (3 1 1) texture. At the transitio
n temperature, the grain structure tended to shift from the polycrysta
lline to the amorphous state with increasing deposition pressure and f
ilm thickness. It was found that nucleation of amorphous film during i
n situ annealing at the transition temperature without breaking the va
cuum began to occur from surface silicon atom migration, in contrast t
o a heterogeneous nucleation during film deposition.