CHEMICAL AND STRUCTURAL-ANALYSIS OF TIAL THIN-FILMS SPUTTER-DEPOSITEDON CARBON SUBSTRATES

Citation
Jf. Silvain et al., CHEMICAL AND STRUCTURAL-ANALYSIS OF TIAL THIN-FILMS SPUTTER-DEPOSITEDON CARBON SUBSTRATES, Surface & coatings technology, 61(1-3), 1993, pp. 245-250
Citations number
17
Categorie Soggetti
Material Science
ISSN journal
02578972
Volume
61
Issue
1-3
Year of publication
1993
Pages
245 - 250
Database
ISI
SICI code
0257-8972(1993)61:1-3<245:CASOTT>2.0.ZU;2-4
Abstract
Ti50Al50 thin films have been prepared by physical vapour deposition o n carbon substrates and characterized by X-ray analysis and diffractio n and by electron spectroscopies (Auger electron spectroscopy and Al K alpha X-ray photoelectron spectroscopy). Crystalline films are obtaine d after deposition at temperatures higher than 200-degrees-C or after annealing at 750-degrees-C of films deposited at room temperature. The tetragonal structure of the intermetallic TiAl is clearly identified. Auger profiles show a sharp film-substrate interface for deposition a t room temperature and give evidence of a diffusion process at higher temperatures. Oxygen and carbon are detected whatever the sputtering c onditions are. The chemical environment of Al, Ti, O and C is discusse d and the possibility of formation of ternary (perovskites or H phases ) or quaternary compounds (especially at the interface) is proposed.