Jf. Silvain et al., CHEMICAL AND STRUCTURAL-ANALYSIS OF TIAL THIN-FILMS SPUTTER-DEPOSITEDON CARBON SUBSTRATES, Surface & coatings technology, 61(1-3), 1993, pp. 245-250
Ti50Al50 thin films have been prepared by physical vapour deposition o
n carbon substrates and characterized by X-ray analysis and diffractio
n and by electron spectroscopies (Auger electron spectroscopy and Al K
alpha X-ray photoelectron spectroscopy). Crystalline films are obtaine
d after deposition at temperatures higher than 200-degrees-C or after
annealing at 750-degrees-C of films deposited at room temperature. The
tetragonal structure of the intermetallic TiAl is clearly identified.
Auger profiles show a sharp film-substrate interface for deposition a
t room temperature and give evidence of a diffusion process at higher
temperatures. Oxygen and carbon are detected whatever the sputtering c
onditions are. The chemical environment of Al, Ti, O and C is discusse
d and the possibility of formation of ternary (perovskites or H phases
) or quaternary compounds (especially at the interface) is proposed.