SERIAL COSPUTTERING OF METALS - MODELING OF SPUTTERING FROM A PERIODICALLY CODEPOSITED SURFACE

Serial cosputtering is a simple yet powerful tool for the deposition o f multilayered thin films with unique physical properties. This articl e studies one specific cosputtering system and discusses how the so-ca lled ''sputter yield amplification effect'' can be utilized to increas e the deposition rates by the suitable choice of both materials used a nd operating conditions. The main emphasis is placed on computer model ling of the system with a view to optimizing the whole technological p rocess. Comparisons between experiment and computer simulation in a nu mber of typical situations is presented.