The thermal stability of sputter-deposited Mo/Si multilayers was inves
tigated by annealing studies at relatively low temperatures (approxima
tely 250-350-degrees-C) for various times (0.5-3000 h). Two distinct s
tages of thermally activated Mo/Si interlayer growth were found: a pri
mary surge, followed by a (slower) secondary steady-state growth in wh
ich the interdiffusion coefficient is constant. The interdiffusion coe
fficients for the interlayer formed by deposition of Mo-on-Si are high
er than those of the interlayer formed by deposition of Si-on-Mo. Assu
ming that the activation energy is constant, an extrapolation of our r
esults to ambient temperature finds that interlayer growth is negligib
le, suggesting long-term thermal stability in soft-x-ray projection li
thography applications.