ATTACHMENT OF SOLDER BALL CONNECT (SBC) PACKAGES TO CIRCUIT CARDS

IBM has developed an assembly process to attach a new family of Solder Ball Connect (SBC) integrated circuit packages to glass/epoxy cards u sing surface mount technology (SMT). The process provides nearly perfe ct yields for the resulting solder ball joint structures and ensures r eliability by controlling wear-out due to metallurgical fatigue. The p ackage, card, and process parameters found to most strongly influence the assembly yield and reliability are summarized, and unique test har dware and analysis techniques are discussed. Process considerations, a nalytical techniques, and test methods described for SBC packages shou ld apply to other ball grid array (BGA) packages.