M. Zakaullah et al., EFFECT OF INSULATOR SLEEVE CONTAMINATION ON THE LOW-ENERGY PLASMA-FOCUS PERFORMANCE, Fusion engineering and design, 23(4), 1994, pp. 359-365
The characteristics of a low energy plasma focus of copper electrodes
operated by a single 32 muF, 15 kV (3.6 kJ) capacitor with an insulato
r sleeve contamination are studied. When the plasma focus is operated,
the insulator sleeve is contaminated due to the deposition of copper
evaporated from the electrodes, A slight contamination improves the sy
stem performance When the cumulative discharge energy over successive
shots across the insulator sleeve exceeds approximately 1 MJ, the copp
er deposition on the sleeve surface makes it rough with a grain-type s
tructure, with as result that the system becomes less reproducible and
shot-to-shot variations in neutron yield are pronounced. In addition,
a high voltage probe records multiple foci formation, giving rise to
multiple neutron pulses, multiple X-ray pulses as well as multiple ion
beams. When the cumulative discharge energy approaches 1.6 MJ, the ne
utron yield starts deteriorating, and the resistor divider signal begi
ns to indicate less compression. It is suggested that the neutron yiel
d degradation occurs due to copper coating with grain structure on the
sleeve surface, which decreases the resistance of the sleeve surface
and may therefore increase the current partition and eventually lower
the snowplow efficiency. The situation may improve if low-sputtering-r
ate conductors are employed for the electrodes of the device or the tr
uncated end of the anode is lined with low sputtering rate material li
ke molybdenum.