ULTRAFINE-PARTICLE BEAM DEPOSITION-II - MECHANISM OF FILM FORMATION

A new handling technique of ultrafine particles, called ''ultrafine-pa rticle beam deposition,'' was applied to the preparation of various fi lms, such as of Ag, Au, Cu, Fe, Ni, Pt, Ta and W. The mechanism of dep osition and coalescence of ultrafine particles is thought to be descri bed by the diffusion process. The high surface activity of ultrafine p articles was preserved in this handling technique, and the obtained fi lms had low electric resistances close to those of corresponding bulk metals.