Silicon-on-insulator (SOI) structures formed by high-dose ion implanta
tion were investigated using the electroreflectance spectroscopy (ER)
method. The spatial distributions of defects and mechanical stresses i
n the silicon overlayer as well as the properties of the interface bet
ween buried dielectric layer and silicon substrate were studied. It is
shown that combined implantation of C+, O+ and N+ ions allows one to
create SOI structures with a defectless superficial silicon layer. Sup
plementary investigations of the above mentioned SOI structures were a
lso carried out by the Auger electron spectroscopy, transmission elect
ron microscopy and I-V characteristic method.