OBSERVATION AND X-RAY-ANALYSIS OF THE MICROSTRUCTURES FOR A BONDING MATERIAL OF C C COMPOSITE AND COPPER/

The purpose of this study is to examine the microstructure of a bondin g material of C/C composite and copper before and after thermal shock tests, Optical and scanning electron microscopy, and energy dispersive X-ray analysis were used to study the microstructures before and afte r thermal shock tests. In this study, the specimen were given thermal shock without an active cooling, therefore, these tests are considered to simulate only heat load at the most severe condition as an acciden t. The bonding material was not fractured by the thermal shock tests, however, thermal cracks and delaminations were found in the bonding la yers.