Corrosion and oxidation of copper films were evaluated as a function o
f surface pretreatment with inhibitors. Electrochemical measurements,
accelerated corrosion tests and thermal oxidation were used. Copper su
rfaces were characterized by ellipsometry, Auger electron spectroscopy
, time-of-flight static SIMS, high temperature-Knudsen effusion-mass s
pectrometry and Kelvin probe. Cu does not react with 1 OH-BTA and 1 CH
3-BTA. However, 5 CH3-BTA, 5 CL-BTA and 1 H-BTA form protective surfac
e films with a number of similar characteristics : growth kinetics, th
ermal stability, degree of polymerization and surface wetting. The ext
ent of corrosion protection provided by these films is comparable in m
any cases. However, in chloride-containing atmospheres, surfaces treat
ed with 5 CI-BTA are the most resistant to corrosion.