GROWTH-KINETICS, POLYMERIZATION AND PROTECTION OF CU-X-BTA FILMS

Citation
V. Brusic et al., GROWTH-KINETICS, POLYMERIZATION AND PROTECTION OF CU-X-BTA FILMS, Revue de métallurgie, 90(12), 1993, pp. 1631-1635
Citations number
6
Categorie Soggetti
Metallurgy & Mining
Journal title
Revue de métallurgie
ISSN journal
00351563 → ACNP
Volume
90
Issue
12
Year of publication
1993
Pages
1631 - 1635
Database
ISI
SICI code
Abstract
Corrosion and oxidation of copper films were evaluated as a function o f surface pretreatment with inhibitors. Electrochemical measurements, accelerated corrosion tests and thermal oxidation were used. Copper su rfaces were characterized by ellipsometry, Auger electron spectroscopy , time-of-flight static SIMS, high temperature-Knudsen effusion-mass s pectrometry and Kelvin probe. Cu does not react with 1 OH-BTA and 1 CH 3-BTA. However, 5 CH3-BTA, 5 CL-BTA and 1 H-BTA form protective surfac e films with a number of similar characteristics : growth kinetics, th ermal stability, degree of polymerization and surface wetting. The ext ent of corrosion protection provided by these films is comparable in m any cases. However, in chloride-containing atmospheres, surfaces treat ed with 5 CI-BTA are the most resistant to corrosion.