PATTERNING OF SELF-ASSEMBLED FILMS USING LITHOGRAPHIC EXPOSURE TOOLS

This paper presents an approach for fabricating surfaces with precise positional control of chemical functionalities at submicron resolution s using direct patterning of organosilane self-assembled monolayer fil ms (SAFs) with lithographic exposure tools. Although the process is of general applicability, microelectronics applications are emphasized h ere. The suitability of monolayer SAFs for high resolution patterning is discussed and deep UV photochemical mechanisms for several classes of SAFs are presented. Selective electroless metallization of patterne d SAFs provides sufficient plasma etch resistance and compatibility wi th current microelectronics processing technologies to allow fabricati on of functioning Si MOSFET test structures. Unique features of the pr ocess, including an ability to utilize a variety of substrates and con trol metal film adhesion by judicious choice of the SAF, are discussed .