A silicon field emitter of a very low voltage emission type has been o
btained. In this emitter, a thermal SiO2 film was used as an insulator
which separates the gate electrode from the cathode substrate. It is
easy to decrease the distance between the gate electrode and the emitt
er by thermal oxidation and oblique deposition process. In this field
emitter, in spite of 3 mum diameter of initial mask size, we were able
to obtain a 400 nm gap which is the distance between the gate electro
de and the emitter tip. Therefore, the onset of emission was establish
ed at gate voltages as low as 10 V with Fowler-Nordheim-like emission
characteristics. Then anode current was 2.5 muA at 25 V in one emitter
and transconductance (g(m) = DELTAIA/DELTAVG) was 0.5 muS.