STRESS-ANALYSIS OF A SILICON-WAFER SLICER CUTTING THE CRYSTAL INGOT

In-plane stress distribution in a spinning free-clamped slicing blade is studied analytically. The blade is subjected to a stationary, distr ibuted, in-plane slicing load along the inner periphery, while it is c lamped and tensioned initially in the radial direction along the outer boundary. The radial, hoop, and shear stresses in the blade are given by sum of the stresses from the tensioning, spinning, and edge loadin g. The solution is obtained by introducing the Lame potential function s and the two-dimensional elasticity theory. Numerical results are pre sented for an actual SUS301 blade cutting a 6-in.-diameter silicon ing ot at 1550 rpm. Results obtained show that the contribution of the sli cing load on the stress distribution is not significant; further the o verall stress distribution is approximated by that of the initial tens ioning except for the case of the shear stress distribution.