SIMULTANEOUS SHALLOW-JUNCTION FORMATION AND GATE DOPING P-CHANNEL METAL-SEMICONDUCTOR-OXIDE FIELD-EFFECT TRANSISTOR PROCESS USING COBALT SILICIDE AS A DIFFUSION DOPING SOURCE
Wm. Chen et al., SIMULTANEOUS SHALLOW-JUNCTION FORMATION AND GATE DOPING P-CHANNEL METAL-SEMICONDUCTOR-OXIDE FIELD-EFFECT TRANSISTOR PROCESS USING COBALT SILICIDE AS A DIFFUSION DOPING SOURCE, Applied physics letters, 64(3), 1994, pp. 345-347
Submicron p-metal-semiconductor-oxide field-effect transistors (MOSFET
s) have been fabricated using cobalt silicide as a diffusion source fo
r forming shallow p-n junctions and as a doping source for undoped as-
deposited amorphous silicon gate (SADDS). The thermal stability of CoS
i2 on polycrystalline silicon is shown to be significantly improved by
using as-deposited amorphous silicon instead of as-deposited polycrys
talline silicon as the gate material. The p-MOSFETs fabricated using t
he SADDS process exhibit excellent characteristics and open up the pos
sibility of eliminating several masks and implants in more complicated
complimentary metal-oxide semiconductor processes.