MOLECULAR-DYNAMICS SIMULATIONS TO INVESTIGATE WAFER BONDED INTERFACES

Authors
SCHEERSCHMIDT K CONRAD D GOSELE U
Citation
K. Scheerschmidt et al., MOLECULAR-DYNAMICS SIMULATIONS TO INVESTIGATE WAFER BONDED INTERFACES, Computational materials science, 7(1-2), 1996, pp. 40-47
Citations number
5
Categorie Soggetti
Material Science
Journal title
Computational materials science → ACNP
ISSN journal
09270256
Volume
7
Issue
1-2
Year of publication
1996
Pages
40 - 47
Database
ISI
SICI code
0927-0256(1996)7:1-2<40:MSTIWB>2.0.ZU;2-8
Abstract
The physical processes of wafer bonding and the resulting structure of interfaces are studied by the combined use of molecular dynamics (MD) structure modelling and high resolution electron microscopy (HREM) st ructure imaging.