P. Buchhagen et T. Bell, SIMULATION OF THE RESIDUAL-STRESS DEVELOPMENT IN THE DIFFUSION LAYER OF LOW-ALLOY PLASMA-NITRIDED STEELS, Computational materials science, 7(1-2), 1996, pp. 228-234
A computer program has been developed to simulate the changes of resid
ual macro stress during plasma nitriding as a function of time and dis
tance from the material surface. This program is based on a model whic
h considers the superposition of the several contributions to stress.
The only inputs required are the plasma nitriding and substrate materi
al parameters. The variables are the change of nitrogen concentration
in solution in the substrate matrix, the volume misfit between The mat
rix and the increasing volume fraction of nitrides, the dissolution of
carbides during the nitriding process in addition to the relaxation o
f stress at the nitriding temperature and the thermal stresses. A comp
arison shows that the simulated residual stress profiles are very simi
lar to those measured by the X-ray diffraction technique for short and
Ion:: nitriding times at different temperatures.