A CONNECTORLESS MODULE FOR AN EHF PHASED-ARRAY ANTENNA (REPRINTED)

Packaging is the largest technology challenge in realizing affordable, high performance EHF communication phased-array antennas for mobile S ATCOM operation. A unique and easy to assemble module-honeycomb antenn a packaging architecture is described, providing a simple mechanical d esign and good antenna performance with repeatable access to the modul es for service when required. The key to affordability and predictable performance is a low parts count, robust, hermetically sealed, radiat ion coupled, MMIC module that uses elastomeric connectors for DC and l ogic interconnections. Antenna assembly and all interconnections are a chieved by means of mechanical fasteners without the need for wire nor solder connections. The design has been validated with 19- and 91-ele ment 20 GHz arrays and a 91-element array at 44 GHz over cone angles t o 70-degrees from broadside.