The use of the photoacoustic technique to monitor the thermal properti
es of materials that can be obtained only as parts of multicomponent s
amples is illustrated by performing the thermal characterization of tw
o porous materials: porous silicon obtained from n-type crystalline si
licon through the spark process and that obtained through the electroc
hemical etching method. This nonseparative, and hence nondestructive,
approach makes use of an effective thermal diffusivity treatment based
on the analogy between thermal and electrical resistances, in combina
tion with simplified compositional models for the corresponding multic
omponent systems. The thermal parameters obtained are in agreement wit
h existent studies concerning the composition of these materials. This
approach offers the possibility of performing the thermal characteriz
ation of other porous semiconductors and analogous materials. (C) 1997
Society of Photo-Optical Instrumentation Engineers.