P. Fath et G. Willeke, POLYCRYSTALLINE SILICON-WAFER ENGINEERING FOR PHOTOVOLTAIC APPLICATIONS, Semiconductor science and technology, 9(1), 1994, pp. 101-104
A mechanical dicing saw in combination with bevelled blades has been u
sed to create a variety of textured structures in cast photycrystallin
e silicon, ribbon, and also single crystalline material far photovolta
ic applications. It is shown that the mechanical grooving step may be
applied consecutively to both the front and the back surfaces of a sil
icon blank. The independence of this method with regard to crystal ori
entation together with a variable blade tip angle represents a hithert
o unknown freedom of poly-Si solar cell design. Flexible textured foil
s with a minimum silicon thickness of 20 mu m are demonstrated. This i
s an important prerequisite for the preparation of highly efficient so
lar cell structures in finely grained polycrystalline sheets with diff
usion lengths smaller than 50 mu m.