Epitaxial germanium films of thickness d almost-equal-to 4 mum, grown
on silicon (001) by a low-temperature MBE process, constituted the bas
e material of a silicon-integrated infrared detector. Characterization
of the fully relaxed films was performed mainly by ex situ techniques
, such as X-ray diffraction, Rutherford backscattering spectrometry an
d channeling, room temperature Hall effect and defect etching. Mesa di
odes, fabricated from the originally p-type Ge films after pn-junction
formation by thermal diffusion of antimony (Sb), showed quantum yield
s above 40% at wavelengths between 1200 nm and 1500 nm without an anti
reflection coating. The rise time of the photodiode signal in response
to a picosecond laser pulse (tau = 300 ps) at a wavelength of 1300 nm
was 530 ps. Forward current-voltage characteristics of the devices we
re described by an ideality factor n = 1.25, while excess current unde
r reverse bias was attributed to leakage caused by threading dislocati
ons in the active layers.