A novel thermosetting resin based on vinylic end groups was prepared a
nd its network formation investigated. 2,2-Bis(4-vinylbenzyloxyphenyl)
hexafluoropropane was prepared by the condensation of vinylbenzyl chlo
ride with Bisphenol-AF in the presence of K2CO3. This distyrenic monom
er was cured thermally to produce a highly crosslinked network with <0
.5% sol fraction. The networks prepared by this reactive monomer were
brittle. However, their fracture toughness could be modified with the
incorporation of vinylbenzyl end-capped perfluoroalkylene aryl ether o
ligomers. The thermoplastic component phase separated into discrete co
mposite particles in the continuous network phase. The thermoplastic m
odified network showed improved fracture toughness without sacrificing
the modulus or good dielectric characteristics.