CURL-FREE HIGH-ADHESION POLYIMIDE COPPER LAMINATE/

Authors
CHEN HL HO SH WANG TH CHEN KM PAN JP LIANG SM HUNG A
Citation
Hl. Chen et al., CURL-FREE HIGH-ADHESION POLYIMIDE COPPER LAMINATE/, Journal of applied polymer science, 51(9), 1994, pp. 1647-1652
Citations number
21
Categorie Soggetti
Polymer Sciences
Journal title
Journal of applied polymer science → ACNP
ISSN journal
00218995
Volume
51
Issue
9
Year of publication
1994
Pages
1647 - 1652
Database
ISI
SICI code
0021-8995(1994)51:9<1647:CHPCL>2.0.ZU;2-5
Abstract
6-Amino-2-(p-aminophenyl) benzimidazole (BIA) was synthesized and empl oyed as a diamine component in the preparation of polyamic acid. The m echanical and thermal properties of polyimides made from BIA as a diam ine component were investigated. A high-adhesion, curl-free polyimide/ copper laminate has been obtained by using BIA as a diamine component. (C) 1994 John Wiley and Sons, Inc.