The pervasiveness of automotive passive restraint systems has emphasiz
ed the need for improving system reliability while simultaneously redu
cing the cost and size of the system. This paper describes the integra
ted silicon automotive accelerometer (ISAAC), which consists of a sili
con micromachined die fabricated in a dissolved-wafer process and a CM
OS ASIC that are combined in a standard plastic package. The resultant
device meets the functional, cost, and reliability requirements of th
e next generation of automotive passive restraint systems.