SURFACE REACTIVITY OF ALKYLGOLD(I) COMPLEXES - SUBSTRATE-SELECTIVE CHEMICAL-VAPOR-DEPOSITION OF GOLD FROM RAUP(CH3)3 (R=CH2CH(3), CH3) AT REMARKABLY LOW-TEMPERATURES
Mmb. Holl et al., SURFACE REACTIVITY OF ALKYLGOLD(I) COMPLEXES - SUBSTRATE-SELECTIVE CHEMICAL-VAPOR-DEPOSITION OF GOLD FROM RAUP(CH3)3 (R=CH2CH(3), CH3) AT REMARKABLY LOW-TEMPERATURES, Inorganic chemistry, 33(3), 1994, pp. 510-517
The reactivity of CH3CH2AuP(CH3)(3) and CH3AuP(CH3)(3) is investigated
on silicon, chromium, copper, PMDAODA polyimide, and silicon dioxide
surfaces at temperatures ranging from 25 to 400 degrees C in an ultrah
igh-vacuum chamber. By exploitation of the advantages of kinetically c
ontrolled reaction conditions and atomically clean surfaces, high-puri
ty gold films are deposited at temperatures as low as room temperature
. The surface reaction generating elemental gold is subject to an unus
ual level of control. Excursions to only moderately higher temperature
serve to tune the process from one which is completely selective for
metal and semiconductor surfaces to one which provides blanket deposit
ion. Enhanced selectivity, allowing the discrimination between differe
nt metal substrates (e.g. Cr versus Cu or Au) is achieved by prior exp
osure of the substrate surface to inhibition agents such as P(CH3)3 an
d BF3, The inhibition by BF3 is essentially complete for deposition on
Cr at 25 degrees C but is reversed by relatively mild heating of the
substrate to 350 degrees C.