AN ACTIVE, MICROFABRICATED, SCALP ELECTRODE ARRAY FOR EEG RECORDING

We describe the microfabrication, packaging, and testing of an active, dry, scalp electroencephalogram (EEC) electrode, The electrode consis ts of a silicon sensor substrate and a custom circuit substrate (2 mu m CMOS technology), A via-hole technology has been developed using rea ctive ion etching with SF6/O-2 gas mixture to make electrical contacts between the sensor and circuit substrates. These substrates and batte ries (power source) are then assembled in a custom package for testing on bench and human subjects.