Microcrystalline silicon films were deposited by diluted-hydrogen meth
od and hydrogen-atom-treatment method at 250 degrees C in a plasma enh
anced chemical vapor deposition system and they were characterized by
nuclear magnetic resonance, Raman spectroscopy, and optical bandgap me
asurements. One-mask a-Si:H thin film transistors (TFT's) were fabrica
ted with those microcrystalline materials as the channel layer. The hi
ghest electron mobilities of the TFT's fabricated by diluted-hydrogen
method and hydrogen-atom-treatment method were 1.23 and 1.04 cm(2)/V.s
, respectively without any thermal treatment steps.