POSTDEPOSITION ANNEALING INFLUENCE ON SPUTTERED INDIUM TIN OXIDE FILMCHARACTERISTICS
Citation
M. Higuchi et al., POSTDEPOSITION ANNEALING INFLUENCE ON SPUTTERED INDIUM TIN OXIDE FILMCHARACTERISTICS, JPN J A P 1, 33(1A), 1994, pp. 302-306
Categorie Soggetti
Physics, Applied
Abstract
The influence of postdeposition annealing on sputtered indium tin oxid
e (ITO) film characteristics were investigated. The annealing experime
nts were carried out in air or vacuum atmosphere. Both air and vacuum
annealing decreased the resistivity up to heat treatment of 200 degree
s C. Over 300 degrees C treatment, air annealing increased resistivity
whereas vacuum annealing decreased it. It was clarified that the resi
stivity depended on the carrier concentration. The lowest resistivity
attained was 1.3 x 10(-4) Omega(.)cm, with film deposited on a 250 deg
rees C heated substrate and annealed in vacuum atmosphere at 300 degre
es C. Transmittance was improved in both air and vacuum annealing. In
air and vacuum annealing, crystallinity improved with increasing annea
ling temperature. The surface topography showed no changes with air or
vacuum annealing.