AL-SIO2-AL SANDWICH MICROSTRIP LINES FOR HIGH-FREQUENCY ON-CHIP INTERCONNECTS

Authors
GONDERMANN J VONKAMIENSKI EGS ROSKOS HG KURZ H
Citation
J. Gondermann et al., AL-SIO2-AL SANDWICH MICROSTRIP LINES FOR HIGH-FREQUENCY ON-CHIP INTERCONNECTS, IEEE transactions on microwave theory and techniques, 41(12), 1993, pp. 2087-2091
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
IEEE transactions on microwave theory and techniques → ACNP
ISSN journal
00189480
Volume
41
Issue
12
Year of publication
1993
Pages
2087 - 2091
Database
ISI
SICI code
0018-9480(1993)41:12<2087:ASMLFH>2.0.ZU;2-5
Abstract
We present details on the high-frequency behavior of a downscaled 2 mu m wide microstrip line, fabricated with both signal and ground conduct ors on top of the substrate. A significantly reduced geometric dispers ion for electric pulses with a bandwidth of several hundred gigahertz is found in time-resolved electrooptic sampling measurements. Addition ally, the strong confinement of the electric field within these surfac e-mounted microstrip lines promises low substrate losses, even on dope d substrates, and reduced crosstalk.