RIGOROUS ANALYSIS OF MIXED TRANSMISSION-LINE INTERCONNECTS USING THE FREQUENCY-DOMAIN TLM METHOD

A rigorous analysis of mixed transmission line interconnects is presen ted using an improved version of the frequency-domain TLM method. Dire ct via hole through connections and indirect coupling effects between layered microstrip and coplanar waveguides are investigated as well as the effect of bonding wire transitions between MMIC modules and the m icrostrip substrate carrier. This investigation is extended to include the abrupt transition from a GaAs-based microstrip line to a rib-type microstrip line, which has not been analyzed before. In the context o f this work new developments of the frequency-domain TLM method will b e discussed. In particular it will be shown that the transmission line nodes used in the FDTLM can be obtained either by modifying the exist ing time-domain TLM nodes or directly in the frequency domain. The lat ter approach leads to a faster algorithm.