ION SHOWER DOPING IN POLYCRYSTALLINE SILICON

Citation
Y. Mishima et al., ION SHOWER DOPING IN POLYCRYSTALLINE SILICON, Fujitsu Scientific and Technical Journal, 29(4), 1993, pp. 322-329
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
00162523
Volume
29
Issue
4
Year of publication
1993
Pages
322 - 329
Database
ISI
SICI code
0016-2523(1993)29:4<322:ISDIPS>2.0.ZU;2-5
Abstract
To fabricate polycrystalline silicon thin-film transistors, a low temp erature doping technique is needed. ion shower doping using P2HX (x = 1, 2,...) as the main ion source was investigated, because this tequni que implants molecules and hydrogen atoms in the surface of the polycr ystalline silicon with a low acceleration voltage. The sheet resistanc e was significantly reduced by raising the implantation temperature; a sheet resistance of 5 x 10(2) Omega/rectangle was obtained by implant ation at 200 degrees C without annealing. This improved sheet resistan ce is not due solely to thermal annealing by ion beam heating, rather the impurity profile is averaged by radiation enhanced diffusion, and collisions between atoms produce low-temperature recrystallization in the implanted region.