Ck. Chung et J. Hwang, HIGH-TEMPERATURE STABILITY OF HETEROEPITAXIAL IR-SILICIDE SIGE LAYERSCO-DEPOSITED ON SI(100) UNDER ULTRA-HIGH-VACUUM/, Thin solid films, 239(1), 1994, pp. 112-116
Heteroepitaxial Ir-silicide/SiGe layers have been grown on top of p-Si
(100) at a substrate temperature of 450 degrees C under ultra-high vac
uum. The epitaxial Ir-silicide layer was determined to be Ir3Si4 with
four types of epitaxial modes. Reflection high-energy electron diffrac
tion was used to examine the film quality. The high-temperature stabil
ity of the epitaxial Ir3Si4/SiGe layers was investigated by rapid ther
mal annealing the Ir3Si4/SiGe layers at 550, 750 and 950 degrees C for
20 s. The chemical composition, microstructures and surface morpholog
ies of the layers were characterized by using Auger electron spectrosc
opy, grazing angle incidence X-ray diffraction, scanning electron micr
oscopy and cross-sectional transmission electron microscopy. A critica
l transition temperature existed between 550 and 750 degrees C for the
Ir3Si4/SiGe layers, beyond which the Ir3Si4/SiGe layers were unstable
during the rapid thermal annealing process. The Ir3Si4 layer became a
mixture of dual Ir-silicide phases containing Ge atoms as the instabi
lity occurred. Because of the thermal instability, the conventional gu
ard-ring fabrication should be performed before deposition of epitaxia
l films.