HIGH-TEMPERATURE STABILITY OF HETEROEPITAXIAL IR-SILICIDE SIGE LAYERSCO-DEPOSITED ON SI(100) UNDER ULTRA-HIGH-VACUUM/

Authors
Citation
Ck. Chung et J. Hwang, HIGH-TEMPERATURE STABILITY OF HETEROEPITAXIAL IR-SILICIDE SIGE LAYERSCO-DEPOSITED ON SI(100) UNDER ULTRA-HIGH-VACUUM/, Thin solid films, 239(1), 1994, pp. 112-116
Citations number
13
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
239
Issue
1
Year of publication
1994
Pages
112 - 116
Database
ISI
SICI code
0040-6090(1994)239:1<112:HSOHIS>2.0.ZU;2-P
Abstract
Heteroepitaxial Ir-silicide/SiGe layers have been grown on top of p-Si (100) at a substrate temperature of 450 degrees C under ultra-high vac uum. The epitaxial Ir-silicide layer was determined to be Ir3Si4 with four types of epitaxial modes. Reflection high-energy electron diffrac tion was used to examine the film quality. The high-temperature stabil ity of the epitaxial Ir3Si4/SiGe layers was investigated by rapid ther mal annealing the Ir3Si4/SiGe layers at 550, 750 and 950 degrees C for 20 s. The chemical composition, microstructures and surface morpholog ies of the layers were characterized by using Auger electron spectrosc opy, grazing angle incidence X-ray diffraction, scanning electron micr oscopy and cross-sectional transmission electron microscopy. A critica l transition temperature existed between 550 and 750 degrees C for the Ir3Si4/SiGe layers, beyond which the Ir3Si4/SiGe layers were unstable during the rapid thermal annealing process. The Ir3Si4 layer became a mixture of dual Ir-silicide phases containing Ge atoms as the instabi lity occurred. Because of the thermal instability, the conventional gu ard-ring fabrication should be performed before deposition of epitaxia l films.