H. Stippel et S. Selberherr, MONTE-CARLO SIMULATION OF ION-IMPLANTATION FOR 3-DIMENSIONAL STRUCTURES USING AN OCTREE, IEICE transactions on electronics, E77C(2), 1994, pp. 118-123
A fully.three-dimensional simulation tool for modeling the ion implant
ation in arbitrarily complex three-dimensional structures is described
. The calculation is based on the Monte Carlo (MC) method. For MC simu
lations of realistic three-dimensional structures the key problem is t
he CPU-time consumption which is primarily caused by two facts. (1) A
large number of ion trajectories (about 10(7)) has to be simulated to
get results with reasonable low statistical noise. (2) The point locat
ion problem is very complex in the three-dimensional space. Solutions
for these problems are given in this paper. To reduce the CPU-time for
calculating the numerous ion trajectories a superposition method is a
pplied. For the point location (geometry checks) different possibiliti
es are presented. Advantages and disadvantages of the conventional int
ersection method and a newly introduced octree method are discussed. T
he octree method was found to be suited best for three-dimensional sim
ulation. Using the octree the CPU-time required for the simulation of
one ion trajectory could be reduced so that it only needs approximatel
y the same time as the intersection method in the two-dimensional case
. Additionally, the data structure of the octree simplifies the coupli
ng of this simulation tool with topography simulators based on a cellu
lar method. Simulation results for a three-dimensional trench structur
e are presented.