A software package has been developed for simulating complex silicon a
nd heterostructure devices in 3D. Device geometries are input with a m
ouse-driven geometric modeler, thus simplifying the definition of comp
lex 3D shapes. Single components of the device are assembled through b
oolean operations. Tetrahedra are used for grid generation, since any
plane-faced geometry can be tessellated with tetrahedra, and point den
sities can be adapted locally. The use of a novel octree-like data str
ucture leads to oriented grids where desirable. Bad angles that preven
t the convergence of the control volume integration scheme are elimina
ted mostly through topological transformations, thus avoiding the inse
rtion of many redundant grid points. The discretized drift-diffusion e
quations are solved with an iterative method, using either a decoupled
(or Gummel) scheme, or a fully coupled Newton scheme. Alternatively,
generated grids can be submitted to a Laplace solver in order to calcu
late wire capacitances and resistances. Several examples of results il
lustrate the flexibility and effectiveness of this approach.