Cl. Rohrer, INTERATOMIC POTENTIALS FOR AL-CU-AG SOLID-SOLUTIONS, Modelling and simulation in materials science and engineering, 2(1), 1994, pp. 119-134
A set of embedded atom method (EAM) interatomic potentials for dilute
Al-Cu-Ag solid solutions has been developed. These potentials reproduc
e the experimental elastic constants, stacking fault energies, vacancy
formation energies, and migration energies of the pure metals, as wel
l as the migration energies of Cu and Ag in Al and the dependence of h
ost lattice parameter on solid solution composition. With these potent
ials, simulations can be carried out which may provide insight into su
ch phenomena as interface segregation, the influence of composition on
stacking faults, and dislocation-solute interactions in binary Al-Cu,
Al-Ag, and Cu-Ag and ternary Al-Cu-Ag solid solutions.