Thin films of Ta2O5 have been deposited by oxygen ion-assisted electro
n-beam evaporation using 02+ ion energies of 100 eV and 1000 eV. A max
imum refractive index of 2.14 and an extinction coefficient of 3 x 10(
-4) at 633 nm were found under the optimum conditions of 100 eV ion as
sistance. The film stress was found to change from tensile to compress
ive under ion assistance and a maximum stress of -0.4 GPa was recorded
. The film hardness also increased with the degree of ion assistance f
rom 7.4 GPa for evaporation only to a maximum hardness of 10.3 GPa for
films deposited by ion assistance onto Si. A linear relationship was
found between the refractive index and the packing density for films d
eposited using 100 eV O2+ ions.