IN-SITU ATOMIC-FORCE MICROSCOPY STUDY OF THE PLATING AND STRIPPING OFSILVER

The morphology of silver deposited on a platinum electrode from aqueou s solutions of H2SO4, Na2SO4, and Ag2SO4 was investigated for differen t concentrations of silver ions and different potential sweep rates (1 , 4, and 10 mV/s) using in situ electrochemical atomic force microscop y (ECAFM). At a sweep rate of 1 mV/s two kinds of silver crystals form ed: smaller ones (distributed uniformly over the electrode surface) an d larger ones (nucleated on scratches). At faster sweep rates the depo sit becomes more uniform. The roughness of the silver deposit decrease d and the deposit uniformity increased during extended cycling at a co nstant sweep rate. Some artifacts due to the presence of the AFM tip w ere observed when the force between the tip and the electrode surface was large.