Copper and diamond both have cubic crystal structures and similar latt
ice constants, making Cu an excellent candidate substrate for the hete
roepitaxial growth of electronic device quality diamond. In this study
a Cu substrate preparation method was developed to obtain large-area,
free-standing polycrystalline diamond films. Concurrently, a statisti
cally designed experiment was used to maximize the diamond film qualit
y and resulted in (111) and (100) faceted films of quality comparable
to or better than those grown on Si. The diamond films were analyzed b
y Raman spectroscopy, x-ray diffraction, and scanning electron microsc
opy.